Simulation of the delamination of thin films

S. Scarle*, C. P. Ewels, M. I. Heggie

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

We simulate thin film delamination using a lattice springs model. We use this model to construct a phase diagram of different delamination behaviours, produced by varying the compression of the film and also the radius to which local relaxation is allowed to take place about failing bonds. From this we see a progression from laminar and linear behaviours to radial and rounded features as compressive stress is increased. Sinusoidal telephone cord behaviour occurs only at a small range of fairly low stresses, and thin films.

Original languageEnglish
Pages (from-to)529-534
Number of pages6
JournalEuropean Physical Journal B
Volume46
Issue number4
DOIs
Publication statusPublished - 7 Sept 2005
Externally publishedYes

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