A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application

Jasim Uddin; M. N. Shakib; Syed Zahurul Islam; Md Mahadi Hasan; Habib Ullah; Md Arafatur Rahman

doi:10.1109/ITSS-IoE56359.2022.9990955

A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application

Jasim Uddin^*, M. N. Shakib, Syed Zahurul Islam, Md Mahadi Hasan, Habib Ullah, Md Arafatur Rahman

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

Integrated circuits employing CMOS RF technology are increasingly common and widely deployed. There are currently a wide range of materials available for use in the process that are optimised for RF noise, matching characteristics, and improved resistivity. In this paper, the highly resistive passive resistor component is used in the power splitter circuits, where a high sheet polysilicon resistor is the best choice. The high sheet polysilicon resistor and its extracted parasitic capacitance are shown to be the best match among the various resistors mentioned in the literature. Power splitter circuits use these resistor characteristics to get the best possible results, such as low return and insertion losses and good isolation. In order to get the desired resistor values for the power splitter's individual components, twelve parallel high sheet poly resistors are employed. A total of six electronic componentsâtwo metal finger capacitors and four lumped element spiral inductorsâare employed. Power splitter and probe pad components from the layout are on display. The correctness of the layout is confirmed by simulations run before to and after layout. The design schematic, pre-layout and post layout simulation results confirms that high sheet polysilicon resistors are the best selected potential candidate for RFIC application.

Original language	English
Title of host publication	International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665459983
DOIs	https://doi.org/10.1109/ITSS-IoE56359.2022.9990955
Publication status	Published - 28 Dec 2022
Event	2022 International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022 - Virtual, Online, Yemen Duration: 3 Dec 2022 → 5 Dec 2022

Publication series

Name	International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022

Conference

Conference	2022 International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022
Country/Territory	Yemen
City	Virtual, Online
Period	3/12/22 → 5/12/22

Keywords

High Sheet Polysilicon resistor
N-well Resistor
RF CMOS
Splitter

Access to Document

10.1109/ITSS-IoE56359.2022.9990955

Cite this

Uddin, J., Shakib, M. N., Islam, S. Z., Hasan, M. M., Ullah, H., & Rahman, M. A. (2022). A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application. In International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022 (International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITSS-IoE56359.2022.9990955

Uddin, Jasim ; Shakib, M. N. ; Islam, Syed Zahurul et al. / A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application. International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022).

@inproceedings{1170df0bb322498d8803636ea1c6fb36,

title = "A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application",

abstract = "Integrated circuits employing CMOS RF technology are increasingly common and widely deployed. There are currently a wide range of materials available for use in the process that are optimised for RF noise, matching characteristics, and improved resistivity. In this paper, the highly resistive passive resistor component is used in the power splitter circuits, where a high sheet polysilicon resistor is the best choice. The high sheet polysilicon resistor and its extracted parasitic capacitance are shown to be the best match among the various resistors mentioned in the literature. Power splitter circuits use these resistor characteristics to get the best possible results, such as low return and insertion losses and good isolation. In order to get the desired resistor values for the power splitter's individual components, twelve parallel high sheet poly resistors are employed. A total of six electronic components{\^a}two metal finger capacitors and four lumped element spiral inductors{\^a}are employed. Power splitter and probe pad components from the layout are on display. The correctness of the layout is confirmed by simulations run before to and after layout. The design schematic, pre-layout and post layout simulation results confirms that high sheet polysilicon resistors are the best selected potential candidate for RFIC application.",

keywords = "High Sheet Polysilicon resistor, N-well Resistor, RF CMOS, Splitter",

author = "Jasim Uddin and Shakib, {M. N.} and Islam, {Syed Zahurul} and Hasan, {Md Mahadi} and Habib Ullah and Rahman, {Md Arafatur}",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022 ; Conference date: 03-12-2022 Through 05-12-2022",

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Uddin, J, Shakib, MN, Islam, SZ, Hasan, MM, Ullah, H & Rahman, MA 2022, A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application. in International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022. International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022, Institute of Electrical and Electronics Engineers Inc., 2022 International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022, Virtual, Online, Yemen, 3/12/22. https://doi.org/10.1109/ITSS-IoE56359.2022.9990955

A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application. / Uddin, Jasim; Shakib, M. N.; Islam, Syed Zahurul et al.
International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application

AU - Uddin, Jasim

AU - Shakib, M. N.

AU - Islam, Syed Zahurul

AU - Hasan, Md Mahadi

AU - Ullah, Habib

AU - Rahman, Md Arafatur

PY - 2022/12/28

Y1 - 2022/12/28

N2 - Integrated circuits employing CMOS RF technology are increasingly common and widely deployed. There are currently a wide range of materials available for use in the process that are optimised for RF noise, matching characteristics, and improved resistivity. In this paper, the highly resistive passive resistor component is used in the power splitter circuits, where a high sheet polysilicon resistor is the best choice. The high sheet polysilicon resistor and its extracted parasitic capacitance are shown to be the best match among the various resistors mentioned in the literature. Power splitter circuits use these resistor characteristics to get the best possible results, such as low return and insertion losses and good isolation. In order to get the desired resistor values for the power splitter's individual components, twelve parallel high sheet poly resistors are employed. A total of six electronic componentsâtwo metal finger capacitors and four lumped element spiral inductorsâare employed. Power splitter and probe pad components from the layout are on display. The correctness of the layout is confirmed by simulations run before to and after layout. The design schematic, pre-layout and post layout simulation results confirms that high sheet polysilicon resistors are the best selected potential candidate for RFIC application.

AB - Integrated circuits employing CMOS RF technology are increasingly common and widely deployed. There are currently a wide range of materials available for use in the process that are optimised for RF noise, matching characteristics, and improved resistivity. In this paper, the highly resistive passive resistor component is used in the power splitter circuits, where a high sheet polysilicon resistor is the best choice. The high sheet polysilicon resistor and its extracted parasitic capacitance are shown to be the best match among the various resistors mentioned in the literature. Power splitter circuits use these resistor characteristics to get the best possible results, such as low return and insertion losses and good isolation. In order to get the desired resistor values for the power splitter's individual components, twelve parallel high sheet poly resistors are employed. A total of six electronic componentsâtwo metal finger capacitors and four lumped element spiral inductorsâare employed. Power splitter and probe pad components from the layout are on display. The correctness of the layout is confirmed by simulations run before to and after layout. The design schematic, pre-layout and post layout simulation results confirms that high sheet polysilicon resistors are the best selected potential candidate for RFIC application.

KW - High Sheet Polysilicon resistor

KW - N-well Resistor

KW - RF CMOS

KW - Splitter

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M3 - Conference contribution

AN - SCOPUS:85146496752

T3 - International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022

BT - International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022

PB - Institute of Electrical and Electronics Engineers Inc.

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Uddin J, Shakib MN, Islam SZ, Hasan MM, Ullah H, Rahman MA. A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application. In International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022. Institute of Electrical and Electronics Engineers Inc. 2022. (International Conference on Intelligent Technology, System and Service for Internet of Everything, ITSS-IoE 2022). doi: 10.1109/ITSS-IoE56359.2022.9990955

A Scalable Power Splitter using High Sheet Polysilicon Resistor Suitable for RFIC Application

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