A Condition Monitoring System for the Analysis of Bearing Distributed Faults

Muhammad Irfan, Nordin Saad, Ansar Ali, K. Vinoth Kumar, M. Aman Sheikh, M. Awais

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Citations (Scopus)

Abstract

Condition monitoring is used in the plants to protect rotating equipments from failures and assist the management to plan a required shutdown before failure of the equipment. Bearings are the one of the important components in the rotating machines and premature failure of bearings causes huge financial loses. This paper attempts to analyze the bearing distributed faults through a non-invasive diagnostics approach. The distributed faults are created in the bearing using electric discharge machine. The test rig has been developed for the experimental investigations of the Park analysis approach. The results of the proposed Park approach have been analyzed and shown to be a reliable diagnostics approach for the bearing distributed faults.

Original languageEnglish
Title of host publication2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019
EditorsSatyajit Chakrabarti, Himadri Nath Saha
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages911-915
Number of pages5
ISBN (Electronic)9781728138855
DOIs
Publication statusPublished - 12 Oct 2019
Externally publishedYes
Event10th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019 - New York City, United States
Duration: 10 Oct 201912 Oct 2019

Publication series

Name2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019

Conference

Conference10th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019
Country/TerritoryUnited States
CityNew York City
Period10/10/1912/10/19

Keywords

  • Condition Monitoring
  • Distributed Faults
  • Fault Diagnosis
  • Induction Motor
  • Instantaneous Power Analysis

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