Simulation of the delamination of thin films

We simulate thin film delamination using a lattice springs model. We use this model to construct a phase diagram of different delamination behaviours, produced by varying the compression of the film and also the radius to which local relaxation is allowed to take place about failing bonds. From this we see a progression from laminar and linear behaviours to radial and rounded features as compressive stress is increased. Sinusoidal telephone cord behaviour occurs only at a small range of fairly low stresses, and thin films.